The industry of microelectronic packaging equipments 微電子封裝設(shè)備市場分析
Because the calculation of j - integral is much simpler than other method , and the multilayers and interfaces are ubiquitous in microelectronic packaging structures , it is expected that this method will be widely used in the calculation of the strain energy release rate in high density electrical packaging , especially 并通過實例證明,此新方法對于界面分層問題是可行的。由于j積分計算十分簡便,因此扁平小矩形路徑j(luò)積分方法有望在電子封裝分層能量釋放率計算中得到廣泛的應(yīng)用。